| Product Size | 220~430 |
| Tact Time | 14S |
| Foreign Matter Defects | ≥30μm |
| Visual Defects | ≥100μm |
| Manual Flip Inspection Area | 800Kg/㎡ |
| Assembly Line Area | 500Kg/㎡ |
Equipment Introduction:This equipment is mainly used to detect defects such as foreign particles, bubbles, fibers and residual glue between polarizers and panels after TFT or CF lamination.
Product Inquiry:139-1263-9694
| Product Size | 220~430 |
| Tact Time | 14S |
| Foreign Matter Defects | ≥30μm |
| Visual Defects | ≥100μm |
| Manual Flip Inspection Area | 800Kg/㎡ |
| Assembly Line Area | 500Kg/㎡ |
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